Product

Canon FPA-5520iV Stepper

Enhanced BEOL and FOWLP functionality for optimised production.

Cropped front view of i-Line lithography model Canon FPA-5520iV FPA

≦ 1 µm

resolution

52 mm x 34 mm

exposure area

≦ 150 nm

overlay accuracy

FOWLP

Fan out wafer level packaging

The solution to next-generation packaging challenges

The Canon FPA-5520iV is a high performance i-Line stepper with superior resolution and imaging performance. Meet new challenges, such as fan-out wafer level packaging (FOWLP), via new wafer handling and chucking systems.

Flexible vacuum pads

Enhanced support for warped wafers and chip alignment variations from reconstitution.

Faster exposure

Improved high-intensity illumination optics system for thick photo-resist processes.

Proven technology

Includes projection lens optics and alignment system for high-precision overlay accuracy.

Front view of i-Line lithograph model Canon FPA-5520iV FPA

Product Specifications

Resolution

≤ 1.0 µm

Wafer size

300 mm

Reticle size

6 in. (0.25 in. thick)

Reduction ratio

2:1

Exposure area

52 mm x 34 mm

Overlay accuracy

≤150 nm (|m| + 3σ)

Full view of i-Line lithography machine Canon FPA-5520iV FPA
Lower your semiconductor lithography production costs with the Canon FPA-5520iV

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