Canon FPA-6300ES6a


Canon's new FPA-6300ES6a DUV scanner achieves high throughput and high-overlay accuracy to effectively respond to the advanced needs of chip manufacturers seeking reduced cost of ownership.


  • Supper High Productivity Scanner: Throughput ≥ 200 wafers per hour (300mm wafer).
  • Supper High Overlay Accuracy Scanner: Single machine Overlay ≤ 5nm (m+3sigma).
  • Durability and maintenance improvements in the FPA-6300ES6a.
  • Updated Projection Lens and Upgrade Options extend to next-generation semiconductor manufacturing.

Detailed Features

Take a more detailed look into Canon FPA-6300ES6a

High-Productivity Scanner: Throughput ≥ 200 wafers per hour

The new Canon DUV scanner incorporates a newly designed Reticle Stage and Wafer Stage that achieve accelerated exposure processes, significantly reducing necessary exposure times. By optimizing the wafer alignment sequence and reducing the time of wafer handling and other processes, the FPA-6300ES6a model realizes a high throughput rate of more than 200 wafers per hour, an approximately 60 percent improvement over its predecessor.

High-Accuracy Scanner: Overlay ≤ 5nm

The FPA-6300ES6a DUV scanner employs highly sophisticated stage-control technologies, an improved alignment scope and precise temperature control to make possible an overlay accuracy of 5nm. Additionally, it offers an advanced NA 0.86 projection optical system and a wide range of options to support demanding and robust device production.

200 wafers per hour throughput

The FPA-6300ES6a lithography tool is a KrF stepping scanner that utilizes a new Reticle Stage and Wafer Stage to provide accurate stage synchronization during scan exposure of semiconductor wafers. The new Reticle Stage and Wafer Stage provide increased stage drive acceleration that reduces wafer exposure times substantially.

FPA-6300ES6a stage improvements also reduce wafer loading and alignment times. Overall, the FPA-6300ES6a scanner productivity improvements represent a 60 percent throughput increase to over 200 wafers per hour.

5nm Overlay Accuracy

The FPA-6300ES6a utilizes multiple technologies to provide accurate image overlay during exposure. To reduce image distortion, the FPA-6300ES6a adopts advanced synchronous controls and high-level damping technology to control Reticle and Wafer Stage vibration.

Fine-temperature management technology also improves overlay accuracy by stabilizing air-flow and temperatures around the Reticle Stage, Wafer Stage, Projection Lens and Alignment Scopes.

FPA-6300ES6a overlay options and upgrades allow the scanner to deliver 5nm overlay accuracy to our customers.

Durability and maintenance improvements in the FPA-6300ES6a

Building upon the reliable and stable FPA-6000 Series of scanners, the FPA-6300ES6a provides substantial improvements in terms of base durability and maintenance requirements.

The FPA-6300ES6a platform provides rapid installation and increased system uptime and availability.

Updated Projection Lens and Upgrade Options extend to next-generation semiconductor manufacturing

0.86 High NA (Numerical Aperture) Projection Lens.

FPA-6300ES6a options and upgrades further improve overlay accuracy and productivity, offering scalability to support next-generation semiconductor manufacturing.

Product Specification

Find out more about the Canon FPA-6300ES6a, its features and what it can do.