≤ 0.35 µm
high resolution
Product
Canon FPA-5550iZ2
Multi-solution stepper for logic, memory and image sensor fabrication.
300 mm
wafer size
≤ 15 nm (|m| + 3σ)
SMO overlay accuracy
SSC Unit
Shot Shape Compensator
Optimised sequencing for high-productivity
Reduced wafer processing time and faster calibration processing improves productivity, while Shot Shape Compensator enhances overlay accuracy.
Fast processing
Improved alignment, exposure and wafer transfer reduces processing times.
Shot correction
Shot Shape Compensator corrects vertical and horizontal magnification differences and skew.
System options
A range of solutions for logic, memory, colour filters and image sensors.
Product Specifications
Wafer size
200mm, 300mm
Exposure area
26 mm (max) x 33 mm (max)
Resolution
≤ 0.35 µm
Numerical Aperture (NA)
0.45 ~ 0.57
Overlay accuracy
SMO1 ≤ 15 nm (|m| + 3σ)
MMO2 ≤ 20 nm (|m| + 3σ)*
*Options required
Boost your productivity with the fast and efficient Canon FPA-5550iZ2
Related Range Products
Product
FPA-3030i5+
Superior i-line stepper for environmentally-conscious device and MEMS manufacturers.
Increase your business scope and flexibility with Canon Industrial Products
1. SMO: Single Machine Overlay
2. MMO: Machine-to-machine overlay
3. IoT: Internet of Things
4. MEMS: An abbreviation of "Micro Electro Mechanical Systems" which are devices having micron-level mechanical structures such as collecting sensors and actuators that are integrated with electronic circuitry.
